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Manual gold, silver, nickel plating line:
Application: Gold, silver and nickel plating of IC lead frame and package shell.
Features: Mechanical and Electrical Integration structure, easy operation, high reliability, use countercurrent rinsing and micro drain techniques, energy saving, friendly environment.
Technical Specification: Non-standard specifications, it is customized.
Options: Computer monitoring system, bath solution testing and automatic feed device, cathode shifter.