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Electronic components rack automatic (semi-)plating line:
Application: The mass production of chip component and micro metal parts；Pretreatment, silver plating, nickel, gold plating and tin plating of electronic components.
Project experiences：Electroplating automatic production line for PCB electroless copper plating , DCB electroless nickel plating, microwave aluminum oxide, aluminum coated silver, ceramic metallization plating nickel gold etc.
Features: Reliable system, high product efficiency, bright, fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc，and is easy to adjust process parameter quickly according to different process feature.
Technical Specification:Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-80 Kg.
Options: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control system etc.