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Chip component barrel plating automatic line:
Application: The mass plating production of chip component and micro metal parts；Pretreatment, silver plating, nickel plating and tin plating of chip components.
Project experiences: Electroplating production line for SMD and connectors etc.
Features: The roller is optimal designed of technology according customers requirements. Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc，and is easy to adjust process parameter according to different process feature.
Technical Specification: Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-100 kg.
Options: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.